SUNON, a global leader in thermal management, unveiled its latest liquid cooling solutions at the OCP Global Summit 2025 in the United States. Designed specifically for servers and AI computing, the new lineup features modular architecture and high energy efficiency, delivering stable and reliable cooling for open compute infrastructure.
Under the theme “Build to Chill,” SUNON showcased its commitment to continuous thermal innovation—building not only high-performance cooling systems but also pioneering solutions that drive the future of the industry.
Three core liquid cooling products were introduced:
1. Open Cold Plate System – Supports Intel and AMD server architectures, offering high heat dissipation efficiency and multi-platform flexibility.
2. Coolant Distribution Unit (CDU) – A modular liquid-to-liquid CDU design that allows flexible configuration and easy maintenance.
3. Closed-Loop Liquid Cooling System – Customizable modular components that adapt to various application needs.
With a complete liquid cooling product portfolio, SUNON provides comprehensive thermal solutions that balance performance, quality, and cost-effectiveness. In addition to static displays, live demonstrations drew strong attention from international clients. SUNON will continue to advance open architecture development through innovative cooling technologies, shaping a future of high-performance and sustainable computing.
